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Power Hall-Effect Switch
Features
* * * * * Power Operation (15 W typical at 25C) Omnipolar (switches with N or S pole) 2.5V to 5.5V Operation CMOS Push-Pull Output Ultra Low Offset Canceling Amplifiers Provide Sensitive, Accurate, Stable Switching Points and Immunity to Mechanical Stress * Solid State Reliability * Operating Temperature Range: -40C to +85C * RoHS Compliant TSOT-23 3-Lead Package
MX887P
Description
The MX887P integrated Hall-Effect switch targets the requirements of low-power portable devices with battery operating voltages from 2.5V to 5.5V. On-chip power management circuitry reduces the effective average current to just 5A at VSUPPLY = 3VDC . The switch output will transition to the Ground potential when either a north or south magnetic pole is applied. The removal of a magnetic field will transition the switch to the VSUPPLY potential. Emulating the behavior of a traditional reed switch, together with the advantages of high integration and solid state reliability, makes the MX887P an ideal replacement in low-power portable device applications.
Applications
* * * * * Handheld Portable Devices White Goods Automotive - Body Systems Security Systems High Reliability Reed Switch Replacement
Ordering Information
Pb
RoHS
2002/95/EC
e3
Part
MX887PHTTR
Description
TSOT-23 3L Tape & Reel (3000/Reel)
Figure 1. Functional Block Diagram
VSUPPLY 1
Power Management Logic
Switch
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DS-MX887P - August 10, 2009
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Output Latch
Hall Sensor
Offset Cancellation
Output
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MX887P
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 Package Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.2 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.4 Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.6 Magnetic Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 3 3 3 3 4 4
2. Circuit Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 3. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.1 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.2 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.3 Washing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 5 6 6
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MX887P
1 Specifications
1.1 Package Pinout 1.2 Pin Description
3
Pin# 1 2
Name VSUPPLY OUT
2.5V to 5.5V
Description
Push-Pull CMOS Output
1
2
3
GROUND Ground
1.3 Absolute Maximum Ratings Parameter
Supply Voltage Output Voltage Magnetic Flux Density Output Current Junction Temperature Operating Ambient Temperature Storage Temperature
Symbol
VSUPPLY VOUT B TJ TA TSTG
Min
-0.5 -0.5 -40 -40
Max
6 6 Unlimited 5 150 85 150
Units
VDC V G mA C
Absolute maximum electrical ratings are at 25C. Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied.
1.4 Electrical Characteristics Over operating voltage and temperature range unless otherwise specified. Parameter Supply Voltage Range Output Leakage Current Output On Voltage Awake Time Period Duty Cycle Supply Current Conditions Operating VOUT=5.5V, BRPN < B < BRPS IOUT=1mA, VDD=3.0V Awake (enabled) Asleep (disabled) Average (Calculated) Notes:
ISUPPLY
Symbol
VSUPPLY ILKG VOUT -
Minimum
2.5 -
Typical
100 0.1 5
Maximum
5.5 1 300 90 90 2 8 15
Units VDC
A mV s ms % mA A A
1. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF). 2. Typical data is at 25C and VSUPPLY = 3V.
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MX887P
1.5 ESD Rating ESD Rating (Human Body Model) 2000V
1.6 Magnetic Characteristics Over operating voltage and temperature range unless otherwise specified. Parameter Operating Points Due to North Pole Applied Due to South Pole Applied Release Points Due to North Pole Applied Due to South Pole Applied Hysteresis Notes: North Pole to Branded Side South Pole to Branded Side | BOPX - BRPX |
BRPN BRPS 6 5 -6 G
Conditions North Pole to Branded Side South Pole to Branded Side
Symbol
BOPN BOPS
Minimum
Typical
Maximum
Units
-60 -
-
60
G
G
BHYS
1. As used here, negative flux densities are defined as less than zero (algebraic convention); -50G<+10G. 2. BOPX = operating point (output turns ON); BRPX = release point (output turns OFF). 3. Typical data is at 25C and VSUPPLY = 3V.
2 Circuit Description
The MX887P Power Hall-Effect Switch consists of a Hall element, small-signal amplifier, latch, and CMOS push-pull output. Offset cancellation circuitry rejects errors in signal stages and the influence of mechanical stress on the Hall element. This technique, together with a precision threshold generator and comparator, produces highly accurate magnetic switch points. The Hall element is activated for a small fraction of an operating cycle, then latched in that sample state for the remainder of the period. By using this technique, very low power consumption is achieved.
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MX887P
3 Manufacturing Information
3.1 Mechanical Dimensions 3.1.1 TSOT23 3-Lead Package
0 / 8 2.80 / 3.00 (0.110 / 0.118) 3 2.60 / 3.00 (0.102 / 0.118) 1 0.35 / 0.51 (0.014 / 0.020) 0.75 / 0.90 (0.030 / 0.035) 0.70 / 0.80 (0.028 / 0.031) 5 NOM 7 NOM 2 0.60 REF (0.0236 REF) 0.25 BSC (0.0098 BSC) GAUGE PLANE 0.10 / 0.25 (0.004 / 0.010) 0.95 (0.037) 0.60 (0.024) 1.50 / 1.70 (0.059 / 0.067) 0.37 / 0.47 (0.015 / 0.019) 2.70 (0.106) 0.10 MIN (0.004 MIN)
Recommended PCB Land Pattern
1.05 (0.041)
0.00 / 0.10 (0.000 / 0.004)
0.95 BSC (0.037 BSC) 1.90 BSC (0.0748 BSC)
Dimensions mm MIN / mm MAX (inches MIN / inches MAX)
Notes: (Unless otherwise specified) 1. Dimension "D" does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm (0.004 inches) per side. 2. Dimension "E" does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side. 3. Package top may be smaller than package bottom. Dimensions "D" and "E1" are determined at the outermost extreme of the plastic body excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
3.1.2 Tape & Reel Packaging
178 DIA. (7.01 DIA.) P=4.0 0.1 (0.157 0.004) 2.0 0.05 (0.079 0.002) 3.5 0.05 (0.138 0.002) 1.75 0.1 (0.069 0.004)
0.25 0.05 (0.001 0.002)
o1.5, +0.1, -0 (o0.059, +0.004, -0)
Top Cover Tape Thickness 0.066 MAX. (0.003 MAX.)
BO=3.2 0.1 (0.126 0.004) K0=1.1 0.1 (0.043 0.004)
P=4.0 0.1 (0.157 0.004)
AO=3.2 0.1 (0.126 0.004)
o1.1 0.1 (0.043 0.004)
W=8.0 0.2 (0.315 0.008)
Embossed Carrier
Dimensions mm (inches) NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
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MX887P
3.2 Soldering For proper assembly, the component must be processed in accordance with the current revision of IPC/JEDEC standard J-STD-020. Failure to follow the recommended guidelines may cause permanent damage to the device resulting in impaired performance and/or a reduced lifetime expectancy. 3.3 Washing Clare does not recommend ultrasonic cleaning or the use of chlorinated hydrocarbons.
Pb
RoHS
2002/95/EC
e3
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare's Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-MX887P-August 10, 2009 (c)Copyright 2009, Clare, Inc. All rights reserved. Printed in USA. 8/10/09
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